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The NYU Nanofabrication Facility, located in the Tandon School of Engineering in Brooklyn, NY, is home to world-class micro- and nanofabrication and metrology tools, which meet or exceed the demands of academic and industry users alike. With over ~ 2000 sq. ft. of Class 1000 space, the NanoFab is appropriately equipped to meet the present and future demands for device fabrication.

Equipment

The NYU Nanofabrication Facility houses equipment in approximately 2000 square feet of space. The space contains a Class 1000 air filtration system, in a temperature and humidity controlled environment. The facility contains 4 research bays, each primarily dedicated to a particular type of fabrication process.

  • Photolithography Bay:
    • Contains photoresist spin coating and development hoods, as well as equipment for contact alignment photolithography
    • Contains wafer bonding equipment, capable of bonding wafer pieces from 10 mm x 10 mm up to substrates 6″ in size (Coming soon)
    • Contains metrological equipment for surface and interface characterization
  • Etch Bay:
    • Contains fluorine and chlorine plasma-based ICP Reactive Ion Etching (ICP RIE) and Deep Reactive Ion Etching (DRIE) equipment for etching Si, metals, and dielectrics. The system is equipped with Optical Endpoint Detection (OES), delivering precise etching capability (Coming Soon)
    • Contains an O2 plasma cleaning system
    • Contains wet etch and solvent fume hoods for wet chemicals processing
    • Contains Plasma Enhanced Chemical Vapor Deposition (PECVD) equipment, capable of depositing oxide and nitride thin films (Coming Soon)
  • Deposition Bay:
    • Contains an ALD/PVD-IBE Cluster Tool, which can perform ion-beam etching, as well as the atomic layered deposition (ALD) of dielectrics and the sputtering or evaporation of thin films. The system is equipped with a transfer robot which allows insitu processing between modules
    • Contains a 4 pocket thermal evaporation system
  • E-beam Lithography Bay
    • Contains a Raith 150Two e-beam pattern generator capable of generating features as small as 50 nm with a 20 nm pitch between lines and spaces
    • Contains dedicated e-beam resist spin coating and development fume hoods

Staff

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James Burnette

Manager, Cleanroom and Shared Instrumentation Facilities

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