Equipment

Developer Wet Benches

Photoresist Developer Wet Bench (Located in the Yellow Room, 819F)     E-Beam Developer Wet Bench (Located in the E-Beam Room, 819E)

UVOCS UV Ozone

Applications Removal of residual photoresist and organic contaminants Allowed User Materials Wafers or wafer pieces (new or previously processed) Photoresist Lift-Off resist E-beam resist Example Processes: Wafer de-scum in preparation for metal deposition Wafer cleaning after lift-off process Creating thin oxides on a wafer surface  

Filmetrics F40-UV film thickness monitor

Applications Thickness measurements of thin films Measurement of index of refraction of thin films Specs Thickness measurement range: 40nm-40µm 190-1100 nm wavelength range 7 µm spot size Allowed User Materials Wafers or wafer pieces (new or previously processed) Metals Dielectrics Example Processes: Thickness measurement of a thin SiO2 or SiNx film