NYU Tandon NanoFab Cleanroom
NYU Tandon NanoFab Cleanroom
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Equipment
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equipment
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Deposition and Dry Etching
ALD/PVD/IBE Cluster Tool
Applications
Nano- and micro-fabrication of aspect ratio-dependent structures
Conformal insulating thin-film coating to prevent oxidation (encapsulation)
Sputtering and evaporation of metal thin films
Pre-sputter or pre-evaporation surface cleaning
Specs
IBE
Low-voltage RF ion source
Uniformity ~ ±4% across 4” wafer
Hiden SIMS Endpoint Detection
ALD
Uniformity ~ ± 1% across 4” wafer
2 LVP sources
1 HVP source
1 pulse gas reactant input
PVD
Uniformity ± 5% across 4” wafer for both DC and RF sputter sources
Uniformity ± 4% across 4” wafer for 4 pocket e-beam evaporated source
QDV Transfer Robot
Convenient Transfer of samples between processing Chambers
Allowed User Materials
Wafers or wafer pieces (new or previously processed)
Photoresist
E-Beam Resist (HSQ, ma-N, PMMA, etc.)
Metals
Dielectrics
Example Processes:
Nano pillar definition and device encapsulation
Metal Etch
Dielectric Etch
Resist Clean-up
Al
2
O
3
ALD deposition
Ni sputtering
SiO
2
sputtering
Cr, Al, Pt, Pd evaporation
Safety Guidlines