equipment | Deposition and Dry Etching

ALD/PVD/IBE Cluster Tool


Applications

  • Nano- and micro-fabrication of aspect ratio-dependent structures
  • Conformal insulating thin-film coating to prevent oxidation (encapsulation)
  • Sputtering and evaporation of metal thin films
  • Pre-sputter or pre-evaporation surface cleaning

Specs

IBE

  • Low-voltage RF ion source
  • Uniformity ~ ±4% across 4” wafer
  • Hiden SIMS Endpoint Detection

ALD

  • Uniformity ~ ± 1% across 4” wafer
  • 2 LVP sources
  • 1 HVP source
  • 1 pulse gas reactant input

PVD

  • Uniformity ± 5% across 4” wafer for both DC and RF sputter sources
  • Uniformity ± 4% across 4” wafer for 4 pocket e-beam evaporated source

QDV Transfer Robot

  • Convenient Transfer of samples between processing Chambers

Allowed User Materials

  • Wafers or wafer pieces (new or previously processed)
  • Photoresist
  • E-Beam Resist (HSQ, ma-N, PMMA, etc.)
  • Metals
  • Dielectrics

Example Processes:

  • Nano pillar definition and device encapsulation
  • Metal Etch
  • Dielectric Etch
  • Resist Clean-up
  • Al2O3 ALD deposition
  • Ni sputtering
  • SiO2 sputtering
  • Cr, Al, Pt, Pd evaporation

Safety Guidlines