Applications

• Nano- and micro-fabrication of aspect ratio-dependent structures
• Conformal insulating thin-film coating to prevent oxidation (encapsulation)
• Sputtering and evaporation of metal thin films
• Pre-sputter or pre-evaporation surface cleaning

Specs

IBE

• Low-voltage RF ion source
• Uniformity ~ ±4% across 4” wafer
• Hiden SIMS Endpoint Detection

ALD

• Uniformity ~ ± 1% across 4” wafer
• 2 LVP sources
• 1 HVP source
• 1 pulse gas reactant input

PVD

• Uniformity ± 5% across 4” wafer for both DC and RF sputter sources
• Uniformity ± 4% across 4” wafer for 4 pocket e-beam evaporated source

QDV Transfer Robot

• Convenient Transfer of samples between processing Chambers

Allowed User Materials

• Wafers or wafer pieces (new or previously processed)
• Photoresist
• E-Beam Resist (HSQ, ma-N, PMMA, etc.)
• Metals
• Dielectrics

Example Processes:

• Nano pillar definition and device encapsulation
• Metal Etch
• Dielectric Etch
• Resist Clean-up
• Al₂O₃ ALD deposition
• Ni sputtering
• SiO₂ sputtering
• Cr, Al, Pt, Pd evaporation