Applications

• Depositing thin layers of a metal on a sample surface

Specs

• 3 source thermal evaporation
• ±5% deposition uniformity across 6” wafer

Allowed User Materials

• Wafers or wafer pieces (new or previously processed)
• Photoresist
• Lift-Off Resist

Example Processes:

• Evaporating a layer of Au 100nm thick for use as an alignment mark
• Evaporating a 30 nm total thickness Cr/Au layer for use as a metal contact