NYU Tandon NanoFab Cleanroom
NYU Tandon NanoFab Cleanroom
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Deposition and Dry Etching
Nano-36 Thermal Evaporator
Applications
Depositing thin layers of a metal on a sample surface
Specs
3 source thermal evaporation
±5% deposition uniformity across 6” wafer
Allowed User Materials
Wafers or wafer pieces (new or previously processed)
Photoresist
Lift-Off Resist
Example Processes:
Evaporating a layer of Au 100nm thick for use as an alignment mark
Evaporating a 30 nm total thickness Cr/Au layer for use as a metal contact
Safety Guidlines
Nano-36 Standard Operating Procedure
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