NYU Tandon NanoFab Cleanroom
NYU Tandon NanoFab Cleanroom
Home
About
Facility Access
Fee Schedule
Badger LMS Login
Request an Account
Equipment
User Information
×
equipment
|
Substrate Cleaning
PlasmaEtch PE-50 O2 Plasma
Applications
Removal of photoresist and other organic residues from the surface of a substrate
Allowed User Materials
Wafers or wafer pieces (new or previously processed)
Photoresist
Lift-Off Resist
Metals
Dielectrics
Example Processes:
Wafer Ashing
Wafer Descum
Safety Guidlines
PlasmaEtch PE-50 Standard Operating Procedure
Download