equipment | Substrate Cleaning

PlasmaEtch PE-50 O2 Plasma


  • Removal of photoresist and other organic residues from the surface of a substrate

Allowed User Materials

  • Wafers or wafer pieces (new or previously processed)
  • Photoresist
  • Lift-Off Resist
  • Metals
  • Dielectrics

Example Processes:

  • Wafer Ashing
  • Wafer Descum

Safety Guidlines

PlasmaEtch PE-50 Standard Operating Procedure


NYU Tandon NanoFab Cleanroom  
6 Metro Tech Center
Room 819A
Brooklyn, NY 11201

Jacob Trevino, PhD