equipment | Substrate Cleaning

PlasmaEtch PE-50 O2 Plasma


Applications

  • Removal of photoresist and other organic residues from the surface of a substrate

Allowed User Materials

  • Wafers or wafer pieces (new or previously processed)
  • Photoresist
  • Lift-Off Resist
  • Metals
  • Dielectrics

Example Processes:

  • Wafer Ashing
  • Wafer Descum

Safety Guidlines


PlasmaEtch PE-50 Standard Operating Procedure

Point of Contact


James Burnette

Manager, Cleanroom and Shared Instrumentation Facilities