Alignment Modes

• Top Side
• Back Side

Exposure Modes

• Soft Contact
• Hard Contact
• Vacuum Contact
• Low vacuum contact
• Flood
• Proximity

Specs

• Resolution ~ 2.5 µm
• Alignment Precision down to 0.5 µm
• Light Uniformity ~ 5%

Allowed User Materials

• Wafers or wafer pieces (new or previously processed)
• Photoresist
• Lift-Off Resist
• Photomasks
• Metals
• Dielectrics

Example Processes

• Exposure in vacuum contact mode using AZ 9245 resist for a DRIE process
• Regular and Flood exposure using AZ 5214 resist for pattern inversion
• Hard or Soft contact mode on a wafer piece
• Backside alignment for a MEMs process
• Regular exposure using AZ 5214 and LOR 3A in a lift-off process