equipment | Lithography and Wafer Bonding

Suss MA 6 Contact Aligner


Alignment Modes

  • Top Side
  • Back Side

Exposure Modes

  • Soft Contact
  • Hard Contact
  • Vacuum Contact
  • Low vacuum contact
  • Flood
  • Proximity

Specs

  • Resolution ~ 2.5 µm
  • Alignment Precision down to 0.5 µm
  • Light Uniformity ~ 5%

Allowed User Materials

  • Wafers or wafer pieces (new or previously processed)
  • Photoresist
  • Lift-Off Resist
  • Photomasks
  • Metals
  • Dielectrics

Example Processes

  • Exposure in vacuum contact mode using AZ 9245 resist for a DRIE process
  • Regular and Flood exposure using AZ 5214 resist for pattern inversion
  • Hard or Soft contact mode on a wafer piece
  • Backside alignment for a MEMs process
  • Regular exposure using AZ 5214 and LOR 3A in a lift-off process

Safety Guidlines


Suss MA 6 Contact Aligner Standard Operating Procedure
SOP