NYU Tandon NanoFab Cleanroom
NYU Tandon NanoFab Cleanroom
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Equipment
User Information
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equipment
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Substrate Cleaning
UVOCS UV Ozone
Applications
Removal of residual photoresist and organic contaminants
Allowed User Materials
Wafers or wafer pieces (new or previously processed)
Photoresist
Lift-Off resist
E-beam resist
Example Processes:
Wafer de-scum in preparation for metal deposition
Wafer cleaning after lift-off process
Creating thin oxides on a wafer surface
Safety Guidlines
UVOCS UV Ozone Standard Operating Procedure
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