Applications

  • Removal of residual photoresist and organic contaminants

Allowed User Materials

  • Wafers or wafer pieces (new or previously processed)
  • Photoresist
  • Lift-Off resist
  • E-beam resist

Example Processes:

  • Wafer de-scum in preparation for metal deposition
  • Wafer cleaning after lift-off process
  • Creating thin oxides on a wafer surface

 

Safety Guidlines


UVOCS UV Ozone Standard Operating Procedure

 

NYU Tandon NanoFab Cleanroom  
6 Metro Tech Center
Room 819A
Brooklyn, NY 11201

Jacob Trevino, PhD
jt4292@nyu.edu
646-997-3506